On June 30, 2023, SUN-TEC participated in the "Sixth Ceramic Substrate and Packaging Industry Forum"
Column：Company News
On June 30, 2023, SUN-TEC participated in the "Sixth Ceramic Substrate and Packaging Industry Forum" held in Kunshan and made a report on the "High Performance ceramic substrate molding process and equipment", discussed and exchanged with the participating experts and scholars, and explored the application and development of new materials and new processes.